The collaboration validates 3Dblox workflows for ASE’s VIPack platform across FOCoS, FOCoS-Bridge, and TSV-based 2.5D/3D IC.
Siemens Digital Industries Software announced a collaboration with Advanced Semiconductor Engineering, Inc. (ASE), a global provider of semiconductor assembly and test services, to develop 3Dblox-based workflows for the ASE VIPack platform using Siemens’ Innovator3D IC solution, certified for the 3Dblox standard.
Siemens and ASE have collaborated to validate 3Dblox workflows for three VIPack technologies, including Fanout Chip-on-Substrate, (FOCoS), Fanout Chip-on-Substrate-Bridge (FOCoS-Bridge), and Through Silicon Via (TSV)-based 2.5D and 3D IC.
ASE’s VIPack is comprised of six core packaging technology pillars supported by a comprehensive and integrated co-design ecosystem. As ASE’s advanced packaging platform, it is designed to enable vertically integrated package solutions and represents its next generation of 3D heterogeneous integration architecture that extends design rules and achieves ultra-high density and performance. The platform leverages advanced redistribution layer (RDL) processes, embedded integration, and 2.5D and 3D technologies to help customers achieve unprecedented innovation when integrating multiple chips within a single package.
3Dblox and Innovator3D IC enable System Technology Co-optimization (STCO) driven hierarchical device planning that is considered mandatory for chiplet-based heterogeneous integration using advanced packaging technologies such as those across ASE’s VIPack platform.
To learn more about Siemens’ Innovator 3D IC software, visit eda.sw.siemens.com/en-US/ic-packaging/innovator3d-ic.
